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Electronic Subassemblies
The current state-of-the-art SMT technology, allows the assembling of various components from 0201 to BGA over 35 mm. Humidity-sensitive components are handled within a "dry chain" from warehouse until assembled on the PCB. Processes are permanently controlled, including feedback from AOI and X-ray inspection. The high degree of cleanliness of the assembled PWA is ensured by washing in special equipment, checked and measured with Zero Ion tester. All electronic subassemblies are checked on ICT/JTAG stations or dedicated test equipment. |